Published in Mobiles

Micron announces smallest UFS 4.0 package at MWC 2024

by on27 February 2024

9x13mm chip coming in up to 1TB capacity

At the Mobile World Congress 2024 in Barcelona, Micron has announced its latest UFS 4.0 package aimed at enabling next-generation of phone designs. Coming in up to 1TB of capacity and providing exceptional performance and power efficiency, the new UFS 4.0 package will not only allow smartphone makers to have more space due to the smaller package but also come up with faster and more responsive devices.

The new Micron UFS 4.0 package comes in at 9x13mm, which is an impressive reduction in size considering UFS 4.0 launched in an 11x13mm package. It uses Micron's own 232-layer 3D NAND, allowing it to be available in capacities of up to 1TB. Despite the smaller package, the new Micron UFS 4.0 package offers impressive sequential performance of up to 4,400MB/s for read and up to 4,000MB/s for write, enabling popular large language models in generative AI applications to be loaded up to 40 percent faster. In addition to significant space savings, the new package also has a 25 percent increase in power efficiency.

“Micron’s latest UFS 4.0 solution enables world-class storage performance and reduced power in the world’s smallest UFS package,” said Mark Montierth, general manager and corporate vice president of Micron’s Mobile Business Unit. “Supercharged with breakthrough firmware advancements to keep smartphones running like new, Micron UFS 4.0 raises the bar for mobile storage with enhanced performance, flexibility and scalability to accelerate the rollout of generative AI-capable smartphones.”

According to Micron, the new UFS 4.0 package samples are now shipping in capacities of 256GB, 512GB, and 1TB.

micron ufs40 1


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