Published in Mobiles

MediaTek announces Dimensity 6300 SoC

by on22 April 2024

6nm update of the Dimensity 6100+

MediaTek has announced its newest Dimensity 6300 SoC that will be coming to mid-range smartphones this year. Built on a 6nm manufacturing at TSMC, the Dimensity 6300 SoC is an octa-core SoC with two Cortex-A76 cores and six Cortex-A55 cores, paired up with Mali-G57 MC2 GPU.

According to MediaTek, the new Dimensity 6300 SoC should offer a 10 percent improvement in CPU performance and up to 50 percent GPU performance improvement, compared to the Dimensity 6100+ SoC introduced last year. As said, the Dimensity 6300 is an octa-core design with two Cortex-A76 clocked at 2.4GHz and six Cortex-A55 cores clocked at 2.0GHz. The CPU is paired up with the Mali-G57 MC2 GPU, and MediaTek claims we'll see 11 percent higher power efficiency and up to 13 percent higher FPS in games.

The new GPU supports 10-bit HDR AMOLED screens with up to 120Hz refresh rate, up to 108MP camera system, and the latest 5G modem technologies with a boost in downlink performance up to 20 percent, reaching 3.3Gb/s. It also comes with MediTek's UltraSave 3.0+ technology.

The first phone that should come with the new Dimensity 6300 SoC is the Realme C65 5G, launching next month.

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