Earlier rumors already suggested that 16-core and 12-core Ryzen SKUs could be using a new socket that has more than 4,000 pins, double the amount of cores and double the amount of PCIe lanes, all of which also explains the fact that this multi-chip module design. To be precise, the chip will come with quad-channel DDR4 memory support and have a total of 58 PCIe gen 3.0 lanes.

In case you missed it, a 12-core Ryzen-based SKU has been already spotted in SiSoft Sandra benchmark and a couple of AMD X399/X390 diagrams have already been leaked online.

The good side of the story is that the core clock should not change significantly and it will most likely end up with a 140W TDP for the 12-core part (which has single disabled core per CCX) and 180W TDP for the 16-core version.

The same report, via Techpowerup.com, suggests that AMD might unveil its new Ryzen-based behemoths at the Computex show in Taipei this June with the launch scheduled shortly after it.