The tech will allow customers the flexibility to scale memory needs based on the complexity of various use-cases, and to ultimately accelerate product to market timeline.

ARM has successfully completed the first eMRAM IP test chip tapeout and the compiler IP will be available from 4Q 2018 for lead partners.

This is just the latest of many recent collaborations with Samsung Foundry, including new offerings of Arm’s physical IP for 7LPP and 5LPE EUV, and 11LPP FinFET nodes.

ARM's  vice president marketing, physical design group, Kelvin Low said: "Today’s announcement is only the latest milestone in our collaboration with Samsung Foundry, which began with the 65nm process node and has carried on through recent new offerings of ARM’s physical IP on Samsung Foundry’s 11LPP (11nm Low Power Plus), 7LPP (7nm Low Power Plus) and 5LPE (5nm Low Power Early) process technologies. We have worked closely with Samsung Foundry to develop and verify these manufacturing process innovations using Arm’s physical and processor IP, allowing us to integrate support for these innovations in future CPU, GPU, and other processor cores."

He said the tech will support for HD and UHD logic architectures to optimise circuits for performance, power and area tradeoffs and provide a comprehensive suite of memory compilers, 1.8V and 3.3V GPIO (General-Purpose Input/Output) libraries, and support for CPU frequencies exceeding 3 GHz.

The ARM physical IP for 11LPP FinFET is built on Samsung Foundry’s 14LPP FinFET process technology. It includes a comprehensive suite of logic libraries, memory compilers, and a GPIO library. Additional new ultra-high density standard cell architecture with multi-height support to deliver superior area scaling while maintaining high performance

Low said that with more than 2 GHz CPU frequency target, the ARM 11LPP platform is suitable for the latest consumer designs, high-end wearables and automotive products

The ARM eMRAM compiler IP will be available from 4Q 2018 for lead partners. ARM 7LPP physical IP platform is available starting 3Q 2018 for lead partners, while the 5LPE physical IP platform offering will be available in early 2019. ARM physical IP platform for 11LPP is available for access now for lead partners.