Published in PC Hardware

Infineon releases Thin-TOLL 8x8 and TOLT packages

by on05 June 2024

Smaller more powerful

Infineon has unveiled its latest Thin-TOLL 8x8 and TOLT packages. These cutting-edge solutions optimise space on circuit boards and enhance heat dissipation, making them ideal for a wide range of applications.

For those who came in late, the electronics sector is seeing a big move towards smaller yet more powerful devices, thanks to new tech and efforts to cut carbon emissions.

Infineon is now adding two new sets of CoolSiC MOSFET discrete 650 V products to these packages. These products are built on the second-generation CoolSiC tech, which means they're better performing, more reliable, and easier to use.

These products are aimed at power supplies that need to switch on and off frequently, like those in AI servers, green energy systems, electric vehicle chargers, and big household appliances.

The Thin-TOLL package is just 8x8 mm, and it's the best at handling temperature changes on the board. The TOLT package is cooled from the top and is similar in size to TOLL. Both types give developers advantages, like making server power units for AI thinner and allowing for flat cooling parts.

They also allow more power supply parts to fit on the main circuit board in things like microinverters, 5G, TVs, and power supplies while keeping the parts cool with air. Plus, the TOLT devices round out Infineon's range of top-cooled CoolSiC products, like the CoolSiC 750 V in Q-DPAK. They help developers use less space on the circuit board when they don't need a bigger Q-DPAK package.

You can now get the CoolSiC MOSFETs 650 V G2 in ThinTOLL 8x8 and TOLT with resistance when turned on (R DS(on)) ranging from 20, 40, 50, and 60 milliohms (mΩ). There's also a TOLT option with just 15 mΩ. Infineon plans to offer even more options by the end of 2024.

Infineon will also be showing off these new CoolSiC MOSFET 650 V Gen 2 products at the PCIM event in Nuremberg.

Last modified on 05 June 2024
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