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TSMC starts 3nm semiconductor production

by on29 December 2022

Having a party today 

TSMC is flinging a party today to celebrate the opening of its 3nm semiconductor production. 

The Tame Apple Press has become all moist about the announcement because the company they sold their credibility to will be the primary customer for the first two series of 3nm semiconductors from the Tainan Fab 18.

TSMC will start the New Year with a limited-capacity N3 node process before moving to the more stable and efficient full-production N3E later in 2023, followed by N3P in 2024. That year, TSMC will bring its 2nm GAA process into trial production at a Hsinchu plant for mass production in 2025.

The idea of the announcement is to dispel talk of poor yield rates for 3nm which has failed to make the US tech press and we put it here to remind them what their jobs are. TSMC is going to build two Arizona fabs which will start manufacturing 4nm semiconductors in 2024 and move to 3nm nodes later.

The Chinese are furious about the news accusing the US of tricking TSMC into the deal and stealing technology from "our Taiwan region."

However, despite all the backing from the Tame Apple Press, TSMC is behind its Samsung on the 3nm processing. It began manufacturing 3nm semiconductors in June and is preparing a more energy-efficient 3nm node for 2024. The company's chips will be used in Nvidia graphics cards, Qualcomm mobile processors, IBM CPUs, and Baidu cloud server chips. 

Playing comedy catch-up in Intel which has its 20A "Ångström" node, planned for 2024. The company broke ground on a new Ohio facility in September which is expected to start up in 2025. 


Last modified on 29 December 2022
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