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Diamonds are chip’s best friend

by on18 November 2024


Chip cooling sparkles

Akash Systems has secured a "non-binding preliminary memorandum of terms" for $18.2 million in CHIPS Act funding to scale up the production of its diamond-cooled semiconductors.

The exact methodology behind this diamond cooling technology remains undisclosed, but Akash Systems claims to have fused synthetic diamonds with conductive materials like Gallium Nitride to create semiconductors.

Diamond, being five times more thermally conductive than copper, is ideal for dissipating heat from electronic devices.

Although diamond does not conduct electricity, this fusion technique offers the "best of both worlds," enabling devices to function conventionally while being more thermally efficient. This allows chips to draw more power while running more cooler than conventional materials permit.

Akash Systems boasts several potential benefits of this technology: a 20°C reduction in hot spot temperature, up to 50 per cent reduced fan speeds, 25 per cent more overclocking, a doubled potential server lifetime, and less thermal throttling overall.

The outfit claims its diamond-cooling technology is revolutionising satellite communications. The material's heat-dissipating properties enable five to ten times faster data rates, increased reliability, and a 50 per cent smaller form factor.

Despite these advancements, the receipt of CHIPS Act funding remains uncertain. While this preliminary step is significant, numerous hurdles must be overcome before finalising the financing. Additionally, with a new US administration imminent, the future of CHIPS Act funding is precarious. President-Elect Donald Trump has previously criticised the act, prompting companies to expedite contract approvals before his administration begins on January 20, 2025.

Last modified on 18 November 2024
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