According to a report from Reuters the new regulations were revealed in an email from the US Chamber of Commerce to its members and hint at an upcoming ban on the export of High Bandwidth Memory (HBM).

So far the US and China chip war has slowed China's ambitions to ascend in the semiconductor industry but have also impacted the finances of global players like Nvidia, who are barred from exporting high-performance GPUs to China.

The new sanctions reportedly target around 200 Chinese firms, prohibiting US companies from exporting certain technologies or products to them.

Reuters suggests that the US Department of Commerce aims to implement these regulations before the Thanksgiving break, on 28 November.

Another wave of sanctions is expected in December, specifically targeting the export of HBM to hinder China's progress in the AI domain. These restrictions are already having an impact, with Huawei's Kirin SoCs and Ascend AI accelerators reportedly remaining at 7nm technology until 2026 due to SMIC's inability to procure cutting-edge Extreme Ultraviolet (EUV) machines from ASML needed for their manufacture.

Globally, only a few giants like Intel and Samsung have their own chip design and manufacturing departments. Even so, Intel outsources its latest processors to Taiwan's TSMC, as seen with Arrow Lake and Lunar Lake. This means China must not only design its chips but also fabricate them on homegrown wafers from companies like SMIC.

Overcoming the EUV barrier is essential for China to achieve sub-5nm chip manufacturing capabilities and compete on the global stage.