1Tb TLC and QLC flash chips
Kioxia Corporation and Western Digital Corp., have both announced today details of their newest 3D flash memory technology, the 218-layer 3D NAND with 1Tb TLC and QLC chips.
24.3 per cent quarter-over-quarter
The production and price of 3D NAND memory dropped faster than a free falling team of performing elephants who forgot to pack their parachutes.
Single-gate vertical channel (SGVC)
Macronix is releasing details of a new 3D NAND structure, called single-gate vertical channel (SGVC).
Industry attempts to close global supply shortages
According to sources within the memory industry, global production of 3D NAND flash memory chips is expected to expand substantially in the second half of 2017, exceeding the output of 2D NAND chips by the fourth quarter of the year.
Based on 3D NAND
ADATA revealed its new Ultimate SU700 2.5-inch SATA 6Gpbs SSD series that will use 3D NAND, paired up with a new Maxiotek controller.
Based on 15nm Toshiba TLC NAND
Plextor has announced that it will be showing both the final version of its M8Se performance mainstream SSD as well as future SSDs based on 3D NAND flash at the Consumer Electronics Show 2017 in Las Vegas.
Look out Samsung
Chipzilla has seen how NAND flash storage rising and memory makers are speeding up 3D NAND flash product development and thought “I’ll be ‘aving some of that”.
Based on TLC 3D NAND
According to the latest leaked slide, Intel is working on the new performance-segment 610P series SSD based on TLC 3D NAND, M.2 2280 form-factor and PCIe NVMe interface.
Ready for next year
The Chinese will be switching on their first 12-inch fab and churning out NAND flash and DRAM memory at the end of 2016.