World's first 4-bit-per-cell 3D flash memory

Toshiba has announced the latest generation of 3D flash memory, the 4-bit-per-cell, quadruple-level cell (QLC) technology NAND flash memory.

Ranging from DDR4-2133 to DDR4-3200

AMD has continued to work on updates for its Ryzen CPUs and AM4 motherboards and has posted an extended and updated compatibility of DDR4 memory modules and kits.

Unless no one buys it

Global electronics makers are worried that Apple is going to take all the supplies of memory chips for its new iPhone 8.

Too early for this memory

Volta is out for artificial intelligence, machine learning applications and it will be shipping in DGX 1 systems, mainly for deep learning and AI. The next Geforce will be a  completely separate chip. 

Single bank of memory

After much talking, Hewlett Packard Enterprise has announced it has built a prototype for its big data computer, known as The Machine.

UFS 2.1 storage quietly removed from spec

After Huawei has been caught using different RAM and storage chips on its flagship smartphones, it appears that the time has come for Samsung's latest Galaxy S8 and Galaxy S8+, which have been spotted with both UFS 2.0 and UFS 2.1 storage chips.

Making light of memory

A Vancouver Island chemist has come up a light induced magnetoresistive random-access memory (LI-RAM) that uses light instead of electricity to store and process data.

iPad maker might go for another pile old Tosh

The fruity cargo cult Apple is thinking of dropping a billion or two for the troubled Toshiba semiconductor unit.

Smells like Teen Spirit

Researchers at Duke University have developed "spray-on" digital memory using only an aerosol jet printer and nanoparticle inks.

The Flare X and Fortis series DDR4 memory

Following the launch of AMD's Zen-based Ryzen 7 CPUs, G.Skill has announced two new DDR4 memory series, designed and tested specifically for the  AM4 socket platform, the G.Skill Flare X and Fortis DDR4 memory series.