Built on a 7nm manufacturing process, the Mediatek Dimensity 1000 is based on an octa-core CPU part, with four high-performance Cortex-A77 cores clocked at 2.6GHz and four low-power Cortex-A55 cores clocked at 2.0GHz. It also comes with ARM Mali-G77 MC9 GPU, as well as hexa-core (2+3+1) APU 3.0 for 4.5TOPs of AI performance. It supports up to 16GB of 2-channel LPDDR4x memory and UFS storage.
The rest of the features include new ISP with support for 80-megapixel camera setup or 32+16-megapixel multi-camera with support for 5X ISP (3+2), Video HDR, Depth Engine, AI-3A, AI-NR, AI-HDR, and AI-FD. The ARM Mali-G77 MC9 GPU will bring 4K60 with H.264, H.256/HEVC encoding as well as H.264, H.256/HEVC, VP-9, and AV1 decoding.
Helio 4G moves aside for the new Dimensity 5G lineup
Mediatek was quite keen to note that the Dimensity 1000 is the world's fastest Sub-6GHz 5G Soc, as well as the first one to offer 5G Carrier Aggregation (2CC), offering up to 4.7Gbps of download and up to 2.5Gbps of upload performance, all thanks to the aforementioned carrier aggregation. According to Mediatek, it is also the world's first dual-5G SIM SoC, and it will have support for Wi-Fi 6 and Bluetooth 5.1+.
Mediatek is obviously pushing hard for 5G, and with its recent partnership with Intel, which will put it in Windows-based mobiles by early 2021, it does not come as a surprise that the company is differentiating its new 5G Dimensity family away from 4G Helio family.
“We chose the name Dimensity to highlight how our 5G solutions are driving new waves of innovation and experiences, much like the fabled fifth dimension,” said Joe Chen, Mediatek President.
Mediatek says that we should hear more about the Dimensity 1000 later this year, and see first devices based on the new chipset early next year, which is pretty impressive. Qualcomm will be hosting its own event early next month, and it will be interesting how well will Mediatek compete with its own 5G solution.