According to G.Skill, these kits will use high-performance Samsung B-die ICs, which allowed them to reach DDR4-3600 frequency at tight CL14 latencies. As noted, the new kits will come in 64GB and 32GB capacities kits, with four or two 16GB modules.

The kit will be available across almost the entire G.Skill DDR4 lineup, including Trident Z Neo, Trident Z Royal, Trident Z RGB, and Ripjaws V series.

G.Skill has validated one of those kits on ASUS ROG MAXIMUS XII HERO (WI-FI) Z490 and MSI MEG Z490 GODLIKE motherboards, as well as AMD-based ASUS PRIME X570-P motherboard.

According to G.Skill, new low-latency DDR4-3600 CL14 64GB and 32GB kits should be available in Q4 2020.